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Indiana Department of Environmental Management

Indiana Department of Environmental Management

CTAP > Plating > Plating and Polishing Operations Plating and Polishing Operations

40 CFR 63, Subpart 6W

The U.S. EPA finalized 40 CFR 63, Subpart WWWWWW, Hazardous Air Pollutants: Area Source Standards for Plating and Polishing Operations, on July 1, 2008. It was amended on September 19, 2011.

Additionally, the Compliance Technical Assistance Program (CTAP) may be contacted at (800) 988-7901 for confidential assistance. A CTAP consultation request can be made as well.

What does it affect?

This regulation affects emissions of Cadmium, Chromium, Lead, Manganese, and/or Nickel from any of the following operations:

  • Cadmium, lead, nickel, or lead electroplating
  • Electroless nickel plating *
  • Electroforming
  • Chromate conversion coating *
  • Manganese phosphating *
  • Nickel acetate sealing *
  • Sodium dichromate sealing *
  • Thermal metal spraying
  • Dry mechanical polishing after plating

* Subject only to applicable management practices, as practicable, as well as reporting and recordkeeping.

What is exempt from this regulation?

This regulation exempts the following operations:

  • Hard and decorative chromium electroplating
  • Chromium anodizing
  • Plating and polishing conducted for:
    • Research and development
    • Education
    • Repair of surfaces or equipment
    • Restoration of the original finish
  • Dry mechanical polishing prior to plating
  • Trace quantities of any one of the five (5) metals

Please note a business is exempt from this regulation if it has been determined to be a major source of hazardous air pollutants (HAP).

Control and Management Practices

The following resources contain further information regarding control and management practices of specific operations.

IDEM Resources

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